Peter Lindberg

Licentiate Thesis, Signals and Systems, Uppsala University, December 2005.

The thesis is available from Signals and Systems, Uppsala University, Box 534, SE-751 21 Uppsala, Sweden.

Abstract:

This thesis presents radio frequency integrated circuits and subsystems, together with packaging solutions, for fully integrated compact and low cost Silicon-Germanium (SiGe) 24 GHz transceivers developed during the European Commission funded project ARTEMIS.

The circuits have been manufactured using a commercially available SiGe HBT semiconductor process at ATMEL (Heilbronn, Germany) featuring transistors with 0.8 ìm emitter structures, fmax=90 GHz and fT=80 GHz. For all circuits, standard 20 Ohmcm substrate has been used. Sub-circuits that have been designed and manufactured are 12 GHz VCO:s, polyphase filters, LO pump amplifiers, LNA:s, down- and up-conversion subharmonic mixers, complete receivers and complete transmitters. Measured results of individual circuit blocks, subsystems (e.g. VCO together with polyphase filter) and system performances is presented.

A low loss 24 GHz chip-to-PCB transition using Low Temperature Co-fired Ceramic (LTCC) packaging has been manufactured and evaluated, including a balun structure to interface the differential RFIC with a high gain single ended off-chip patch antenna array. Finally, measurement techniques for on-chip differential circuits is presented.

Source:

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